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The technical foundation of general electronic measuring instruments lies in microelectronics, digital signal processing (DSP) technology, and computer technology. The evolution and development of these instruments can be viewed along two main lines:

Firstly, from the perspective of the adopted technology, it has undergone a progression from analog instruments to digital instruments and then to intelligent instruments. Secondly, in terms of instrument structure (scalability) and implementation form, it has evolved from standalone instruments to modular instruments and then to virtual instruments. Regardless of how instruments ultimately develop, any measuring system includes the following three functional modules: a signal acquisition module (including sensor circuits and signal conditioning circuits), a signal analysis and processing module, and a result expression and output module.

Depending on the measurement object, the forms of the sensors used in measuring instruments differ, but their functions remain the same: to convert natural analog quantities (signals) into electrical signals (voltage or current). The signal conversion and conditioning circuits amplify, attenuate, transform (including frequency conversion, detection, etc.), filter, and adjust the electrical signals from the sensors to a state suitable for analog-to-digital conversion. In the foreseeable future, various sensors, amplifiers, and converters will continue to be analog devices, with sensors being crucial as they determine the instrument's application range. Analog-to-digital converters (ADCs) and signal conversion and conditioning circuits together determine the instrument's bandwidth and measurement accuracy, though the role of ADCs is more critical.

The digitization and software integration of the signal processing part are inevitable choices for instrument development and form the foundation of virtual instruments (VIs). The application of DSP technology has greatly expanded the functionalities of instruments, with the functionality largely depending on the digital signal processing capabilities of the instrument. Additionally, high-speed ADCs are critical in shaping the future direction of test instruments, particularly electronic test instruments. Currently, the bandwidth of high-speed ADCs is beginning to reach the microwave range.

There are two main approaches to implementing digital signal processing: one is based on DSPs, and the other is based on microprocessors (or microcontrollers). The choice between DSP or MCU structures depends on the specific measurement object. Typically, DSPs are used in scenarios requiring complex calculations, high real-time performance, but relatively small programs and single tasks, such as spectrum analyzers and signal analyzers. Microprocessors are used in scenarios requiring complex calculations, large amounts of data and program memory, moderate real-time performance, and complex analysis and processing of measurement data, such as logic analyzers, network analyzers, and biochemical analyzers.

T&M (Test & Measurement) instruments are essential during the early stages of R&D, providing various services for wireless communication measurement, audio and video broadcasting systems, and meeting the needs of customers from diverse markets, including the mobile phone industry, broadcasting industry, electronics industry, and automotive industry.

PRIME, with its many years of rich experience in contract manufacturing, provides professional production and manufacturing services for well-known measurement instrument companies. By manufacturing for globally renowned wireless communication measurement instrument manufacturers, PRIME not only demonstrates its technical and quality capabilities but also positions itself to partner with customers in embracing future products for the Internet of Things and 5G applications.